Dropship INTEL LGA2011 Xeon Thermal Passive, up to 130W Xeon

The INTEL LGA2011 Xeon Thermal Passive solution, specifically the STS200P model, is an essential component for maintaining optimal performance in high-demand computing environments. This passive thermal solution is designed for E5-2600 processors, ensuring efficient heat dissipation without the need for active cooling. With a thermal design power (TDP) of up to 130W, it is perfect for servers and workstations that require reliable cooling in compact spaces.

Key Features of the STS200P

The STS200P is engineered with a combination of aluminum and copper materials, which provide excellent thermal conductivity and durability. Its compact design, standing at only 25.5 mm tall, makes it suitable for installation in 1U and 2U chassis. This is particularly beneficial for data centers and server farms where space is at a premium.

Compatibility and Installation

This thermal solution is compatible with Intel's LGA2011 socket, making it an ideal choice for users looking to upgrade or replace their existing cooling systems. The installation process is straightforward, allowing for quick setup without the need for specialized tools. Proper ducting is recommended to maximize airflow and enhance cooling efficiency.

Benefits of Passive Cooling

One of the significant advantages of the STS200P is its passive cooling design. Unlike traditional cooling solutions that rely on fans, this heat sink operates silently, reducing noise levels in server rooms and office environments. Additionally, the absence of moving parts minimizes the risk of mechanical failure, leading to increased reliability and longevity of the cooling system.

Applications

The INTEL LGA2011 Xeon Thermal Passive solution is ideal for various applications, including enterprise servers, high-performance computing (HPC) systems, and virtualization environments. Its ability to handle processors with a TDP of 130W or lower makes it versatile for different workloads, from data processing to cloud computing.

Conclusion

In summary, the INTEL LGA2011 Xeon Thermal Passive solution is a robust and efficient cooling option for E5-2600 processors. Its compact design, compatibility with 1U and 2U chassis, and passive operation make it a preferred choice for professionals seeking reliable thermal management in their computing systems.